XCS10XLTQ144-4C

Product Summary

The XCS10XLTQ144-4C is a high-volume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates. These requirements include high performance, on-chip RAM, core solutions and prices that, in high volume, approach and in many cases are equivalent to mask programmed ASIC devices. The XCS10XLTQ144-4C is the result of more than 14 years of FPGA design experience and feedback from thousands of customers. By streamlining the Spartan series feature set, leveraging advanced process technologies and focusing on total cost management, the XCS10XLTQ144-4C delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs.

Parametrics

XCS10XLTQ144-4C absolute maximum ratings: (1)VCC, Supply voltage relative to GND: –0.5 to 4.0 V; (2)VIN, Input voltage relative to GND: 5V Tolerant I/O Checked(2, 3): –0.5 to 5.5 V; Not 5V Tolerant I/Os(4, 5): –0.5 to VCC + 0.5 V; (3)VTS, Voltage applied to 3-state output: 5V Tolerant I/O Checked(2, 3): –0.5 to 5.5 V; Not 5V Tolerant I/Os(4, 5): –0.5 to VCC + 0.5 V; (4)TSTG, Storage temperature (ambient): –65 to +150 ℃; (5)TJ, Junction temperature Plastic packages: +125 ℃.

Features

XCS10XLTQ144-4C features: (1)First ASIC replacement FPGA for high-volume production with on-chip RAM; (2)Density up to 1862 logic cells or 40,000 system gates; (3)Streamlined feature set based on XC4000 architecture; (4)System performance beyond 80 MHz; (5)Broad set of AllianceCORE and LogiCORE predefined solutions available; (6)Unlimited reprogrammability; (7)Low cost; (8)System level features: Available in both 5V and 3.3V versions; On-chip SelectRAM memory; fully PCI compliant; Full readback capability for program verification and internal node observability; Dedicated high-speed carry logic; Internal 3-state bus capability; Eight global low-skew clock or signal networks; IEEE 1149.1-compatible Boundary Scan logic; Low cost plastic packages available in all densities; Footprint compatibility in common packages.

Diagrams